Method and apparatus for implanting semiconductor wafer substrates
US7053386B1 · kind B1 · utility
11Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2001 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Jun 25, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/20228
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gripper for loading wafers onto an implant wheel W and removing them from the wheel. The gripper having a substrate engaging mechanism (14) for engaging the substrate and a means for rotating this substrate engaging mechanism, such that wafers can be removed from the implant wheel, rotated to a second orientation and replaced without leaving the process chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.