Leadframe alteration to direct compound flow into package
US7053467B2 · kind B2 · utility
2Cited by
18References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 17, 2002 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Jul 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at a first transition point. The upward slope facilitates the upward flow of the molding compound entering from a bottom gate. Likewise, the leadframe also directs flow in a top gated mold by reversing the orientation of the leadframe or by forming a reverse downset on the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.