Patent · US Expired

Passivation layer structure

US7054469B2 · kind B2 · utility

0Cited by

3References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Siegfried Röhl · Sauerlach, DE
Paul-Werner von Basse · Wolfratshausen, DE
Thomas Scheiter · Munich, DE
Thorsten Sasse · Munich, DE
Heinz Opolka · Regensburg, DE

Key dates

Filing date	Jan 30, 2002
Grant date	May 30, 2006
Priority date	—
Expiry date	Jul 6, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG06V40/1329
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A conductor layer is patterned into flat portions, for example of a fingerprint sensor that effects capacitive measurement. The conductor layer is fragmented in a lattice-like manner by cutouts so that an applied passivation layer rests on a base layer that is present beneath the conductor layer. The interlaminar shear strength of the passivation is increased in this way.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.