Installation for processing a semiconductor wafer and method for operating the installation

US7054714B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Christoph Hocke · Dresden, DE
• Michael Lering · Bubenreuth, DE
• Gregor Kübart · Dresden, DE

Key dates

• Filing date: Mar 27, 2003
• Grant date: May 30, 2006
• Expiry date: Nov 20, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67775
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An installation for processing a semiconductor wafer includes a semiconductor fabrication device having a load port, on which an identity code that can be read optically or through an effective electromagnetic field is stored. A mobile device, for example, a container communicating with the load port or a vehicle for transporting such a container, contains a corresponding reader to determine the identifier. The configuration makes the flexible determination of position within a fabrication facility possible. Also provided is a method for operating the installation.