Semiconductor processing apparatus including plasma-resistant, welded aluminum structures
US7055732B2 · kind B2 · utility
4Cited by
15References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Jun 6, 2006 |
| Priority date | — |
| Expiry date | Oct 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12736
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint, and where the anodized aluminum coating is uniform, providing improved performance over that previously known in the art for welded articles exposed to a corrosive plasma environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.