Method of backgrinding wafers while leaving backgrinding tape on a chuck
US7059942B2 · kind B2 · utility
6Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Nov 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67132
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed from the tape and then cleaned on the front side and backside. A tool for applying tape to a chuck, as described herein, facilitates this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.