Heat treatment device and heat treatment method
US7060944B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 22, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Jan 22, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat treatment apparatus (100) having: a susceptor (2) rotatably provided in a heat treatment vessel (1), on which a wafer (W) is placed; a preheat ring (3) surrounding a periphery of the susceptor (2) to be close to and in non-contact with the susceptor, which is supported by a base (4) provided in the heat treatment vessel (1); and a heating apparatus (8) for heating a wafer (W) placed on the susceptor (2), wherein the preheat ring (3) is formed such that an inner peripheral center (31a) is eccentric to an outer periphery (32). The preheat ring (3) is moved around the susceptor (2); the preheat ring (3) is positioned to minimize a distance between the inner peripheral center (31a) of the preheat ring (3) and the center (2b) of the susceptor (2); and thereafter a heat treatment is performed to a wafer (W).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.