Layout and use of bond pads and probe pads for testing of integrated circuits devices
US7061263B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 15, 2001 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Dec 28, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit die comprising functional circuitry, a plurality of bond pads, each bond pad associated with a respective portion of the functional circuitry and for bonding the respective portion of the functional circuitry, at least one probe pad for testing of the functional circuitry; and multiplexing circuitry between the probe pad and the bond pads, the multiplexing circuitry for multiplexing signals between the probe pad and each of the respective portions of the functional circuitry, thus allowing the respective portions of functional circuitry to be tested using the probe pad and without any contact of the plurality of bond pads by a probe needle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.