Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor
US7062161B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2003 |
| Grant date | Jun 13, 2006 |
| Priority date | — |
| Expiry date | Sep 11, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient α of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.