Electronic package having integrated cooling element with clearance for engaging package

US7064429B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thomas Bemmerl · Schwandorf, DE
• Holger Wörner · Regensburg, DE
• Bernd Waidhas · Nittendorf, DE

Key dates

• Filing date: Jun 20, 2002
• Grant date: Jun 20, 2006
• Expiry date: Jun 20, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component includes at least one semiconductor chip. The semiconductor chip is attached on a first side of a wiring board or a leadframe. The wiring board is provided with interconnect structures at least on a second side. The first side of the wiring board, with the semiconductor chip located on it, is completely enclosed by a package. The package is provided with a cooling element, which is an integral part of the package. The invention also relates to a method for producing the electronic component.