Chuck transport method and system
US7066703B2 · kind B2 · utility
27Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Sep 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for transporting a plurality of substrates between a transfer chamber and at least one processing chamber. The system includes a chuck assembly with a plurality of chucks configured to receive wafer substrates, where the chuck assembly is movably configured to provide for transfer of the plurality of substrates between a transfer chamber and a processing chamber. The system provides a structure that allows for the processing of one substrate on a first chuck, while a second substrate is loaded onto a second chuck and prepared for processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.