Temperature controlled MEMS resonator and method for controlling resonator frequency
US7068125B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2004 |
| Grant date | Jun 27, 2006 |
| Priority date | — |
| Expiry date | Aug 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/02527
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a temperature compensated microelectromechanical resonator as well as fabricating, manufacturing, providing and/or controlling microelectromechanical resonators having mechanical structures that include integrated heating and/or temperature sensing elements. In another aspect, the present invention is directed to fabricate, manufacture, provide and/or control microelectromechanical resonators having mechanical structures that are encapsulated using thin film or wafer level encapsulation techniques in a chamber, and including heating and/or temperature sensing elements disposed in the chamber, on the chamber and/or integrated within the mechanical structures. Other aspects of the inventions will be apparent from the detailed description and claims herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.