Uniform gas cushion wafer support
US7070661B2 · kind B2 · utility
9Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2003 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jul 11, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A workpiece is supported on a gas cushion to reduce mechanical stresses on the workpiece during processing. A plenum having a workpiece support flange for receiving the workpiece is connected to a gas supply. When gas flows into the plenum and pressure increases sufficiently to lift the workpiece, the workpiece is lifted and the gas flows out of the plenum between the flange and the workpiece edge. The workpiece is thus supported above the flange by the gas during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.