Dynamically variable field shaping element
US7070686B2 · kind B2 · utility
61Cited by
6References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2002 |
| Grant date | Jul 4, 2006 |
| Priority date | — |
| Expiry date | Jul 24, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In an electrochemical reactor used for electrochemical treatment of a substrate, for example, for electroplating or electropolishing the substrate, one or more of the surface area of a field-shaping shield, the shield's distance between the anode and cathode, and the shield's angular orientation is varied during electrochemical treatment to screen the applied field and to compensate for potential drop along the radius of a wafer. The shield establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film of conductive metal on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.