Patent · US Expired

Method and apparatus for fabricating a conformal thin film on a substrate

US7071118B2 · kind B2 · utility

2Cited by
76References
40Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 12, 2003
Grant dateJul 4, 2006
Priority date
Expiry dateJun 2, 2024

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/45591
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method and apparatus for fabricating a conformal thin film on a substrate are disclosed. The method includes introducing a gas from a gas inlet into an expansion volume associated with an atomic layer deposition (ALD) system. The gas is flowed through a diffuser plate adjacent to the expansion volume and a reaction chamber. The diffuser plate includes a protrusion located opposite the gas inlet and the protrusion reduces turbulence in the expansion volume.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.