Randhir Bubber
9Patents
8h-index
12Co-inventors
58Inventor score
Filing activity: Dec 22, 1998 → Nov 12, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6365502B1 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 94 | Expired |
| US6294836A | Semiconductor chip interconnect barrier material and fabrication method | Electricity | 92 | Expired |
| US7037574B2 | Atomic layer deposition for fabricating thin films | Emerging Cross-Sectional Technologies | 61 | Expired |
| US6444263B1 | Method of chemical-vapor deposition of a material | Chemistry; Metallurgy | 55 | Expired |
| US6627995B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 42 | Expired |
| US6812126B1 | Method for fabricating a semiconductor chip interconnect | Electricity | 38 | Expired |
| US6645847B2 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Electricity | 37 | Expired |
| US6204204A | Method and apparatus for depositing tantalum-based thin films with organmetallic precursor | Electricity | 29 | Expired |
| US7071118B2 | Method and apparatus for fabricating a conformal thin film on a substrate | Chemistry; Metallurgy | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.