Modular semiconductor workpiece processing tool
US7074246B2 · kind B2 · utility
4Cited by
70References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | May 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.