Semiconductor circuit module and method for fabricating semiconductor circuit modules
US7074696B1 · kind B1 · utility
30Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2003 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | Nov 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for fabricating semiconductor circuit modules having the following steps: application of a patterned connection layer to a transfer substrate, application of active circuit devices and/or passive circuit devices with contact areas pointing toward the patterned connection layer, connection of the circuit devices to one another by means of a filler at least between the circuit devices, removal of the transfer substrate, and application of electrical connection devices for selective contact connection of the contact area of the circuit devices to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.