Microelectromechanical systems and devices having thin film encapsulated mechanical structures

US7075160B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Aaron Partridge · Cupertino, US
• Markus Lutz · Palo Alto, US
• Silvia Kronmueller · Schwaikheim, DE

Key dates

• Filing date: Jun 4, 2003
• Grant date: Jul 11, 2006
• Expiry date: Jun 24, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.