Semiconductor chip assembly with interlocked contact terminal
US7075186B1 · kind B1 · utility
9Cited by
152References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Jul 11, 2006 |
| Priority date | — |
| Expiry date | May 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The contact terminal includes a body and a flange that contact the metal pillar and are spaced from the routing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.