Methods for substrate orientation
US7077973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Aug 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle in a first orientation on a reticle support in a processing chamber, wherein the reticle comprises a metal photomask layer formed on an optically transparent substrate, and a patterned resist material deposited on the metal photomask layer, etching the metal photomask layer in the first orientation, positioning the reticle in at least a second orientation, and etching the metal photomask layer in the at least second orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.