Methods for producing a structured metal layer

US7078309B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gerhard Beitel · Kamakura, JP
• Annette Sanger · Dresden, DE
• Walter Hartner · Munich, DE

Key dates

• Filing date: Dec 11, 2000
• Grant date: Jul 18, 2006
• Expiry date: May 13, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/696
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention provides methods which can be used to structure even precious metal electrodes with conventional CMP steps, in particular with the aid of conventional slurries such as are already used to structure non-precious metals. Owing to the formation of an alloy, the chemically active components of the slurry are capable of attacking the additive to the precious metal in the alloy, as a result of which the surface of the alloy layer is roughened and the mechanical removal of the precious metal is increased.