Processing system and method for thermally treating a substrate
US7079760B2 · kind B2 · utility
36Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2003 |
| Grant date | Jul 18, 2006 |
| Priority date | — |
| Expiry date | Nov 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing system for thermally treating a substrate including a temperature controlled thermal treatment chamber and a temperature controlled substrate holder for supporting a substrate for thermal treatment. The substrate holder is thermally insulated from the thermal treatment chamber. A method for thermally treating a substrate is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.