Patent · US Expired

Polishing apparatus and polishing pad

US7081044B2 · kind B2 · utility

8Cited by

10References

12Claims

0Family size

Assignee

EBARA CORPORATION · JP

Inventors

Shinro Ohta · Tokyo, JP
Kazuo Shimizu · Yokohama, JP

Key dates

Filing date	Jun 12, 2002
Grant date	Jul 25, 2006
Priority date	—
Expiry date	Dec 10, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/30625
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A polishing pad (10) has an upper-layer pad (11) having a hole (11a) defined therein, a light-transmittable window (41) disposed in the hole (11a) for allowing light to pass therethrough, and a lower-layer pad (12) disposed below the upper-layer pad (11) and having a light passage hole (12a) defined therein which has substantially the same diameter as the hole (11a) in the upper-layer pad (11). A transparent film (13) with an adhesive agent applied to upper and lower surfaces thereof is interposed between the upper-layer pad (11) and the lower-layer pad (12). The hole (11a) defined in the upper-layer pad (11) and the light passage hole (12a) defined in the lower-layer pad (12) have substantially the same size as each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.