Shinro Ohta
6Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: Jun 12, 2002 → Sep 4, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8554356B2 | Processing end point detection method, polishing method, and polishing apparatus | Electricity | 20 | Active |
| US7081044B2 | Polishing apparatus and polishing pad | Electricity | 8 | Expired |
| US7021991B2 | Polishing apparatus | Physics | 6 | Expired |
| US8696924B2 | Polishing apparatus and polishing method | Performing Operations; Transporting | 3 | Active |
| US7101257B2 | Substrate polishing apparatus | Electricity | 2 | Expired |
| US10207390B2 | Processing end point detection method, polishing method, and polishing apparatus | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.