Polishing apparatus
US7083506B2 · kind B2 · utility
4Cited by
20References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Aug 1, 2006 |
| Priority date | — |
| Expiry date | Jul 21, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.