Flexible polishing fluid delivery system

US7086933B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Lidia Vereen · Pleasanton, US
• Peter Skarpelos · Berkeley, US
• Brian Downum · Vancouver, US
• Patrick A. Williams · Helena, US
• Terry Kin Ting Ko · South San Francisco, US
• Christopher Heung-Gyun Lee · San Jose, US
• Kenneth R. Reynolds · Middleport, US
• John Hearne · Los Altos, US
• Daniel Hachnochi · Palo Alto, US

Key dates

• Filing date: Apr 22, 2002
• Grant date: Aug 8, 2006
• Expiry date: Jun 22, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B57/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, an apparatus for delivering a polishing fluid to a chemical mechanical polishing surface includes an arm having a plurality of holes formed in the arm for retaining a plurality of polishing fluid delivery tubes. Each of the tubes are disposed through one of the holes and coupled to the arm. The number of holes exceeds the number of tubes, thereby allowing the distribution of polishing fluid to a polishing surface and correspondingly the local polishing rates across a diameter of a substrate being polished to be controlled.