Wafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
US7087122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Dec 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.