Modularized probe card for high frequency probing
US7088118B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 15, 2004 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2822
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.