Device, design and method for a slot in a conductive area
US7089522B2 · kind B2 · utility
19Cited by
13References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Nov 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A design, device, system and process for placing slots in active regions (e.g., metal areas). Embodiments of the present invention improve the planarization of metal areas (e.g., lines) and insulators by reducing depressions (e.g., dishing) in the metal areas by including symmetric or square slots inside selected wide metal lines, by adhering to a set of placement rules. Embodiments reduce dishing in copper dual damascene structures. Embodiments reduce data processing requirements for designing and arranging the layout of IC devices and the slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.