Deposition of integrated circuit fabrication materials using a print head
US7091134B1 · kind B1 · utility
12Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2003 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/135
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The nozzles may be grouped based on the amounts of material they dispense. For example, the nozzles may be grouped by drop volume or drop mass. In one embodiment, an IC fabrication material is dispensed on a substrate by controlling a firing sequence of a nozzle to promote merging of material on the substrate. The firing sequence may also be altered to take into account the firing sequence of adjacent nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.