Mark L. Rea
8Patents
6h-index
15Co-inventors
56Inventor score
Filing activity: Mar 1, 2002 → Sep 13, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7449098B1 | Method for planar electroplating | Electricity | 86 | Expired |
| US8158532B2 | Topography reduction and control by selective accelerator removal | Electricity | 30 | Active |
| US6764168B1 | Sensor for detecting droplet characteristics | Performing Operations; Transporting | 16 | Expired |
| US7091134B1 | Deposition of integrated circuit fabrication materials using a print head | Electricity | 12 | Expired |
| US9607822B2 | Pretreatment method for photoresist wafer processing | Electricity | 11 | Active |
| US8470191B2 | Topography reduction and control by selective accelerator removal | Electricity | 11 | Active |
| US9469912B2 | Pretreatment method for photoresist wafer processing | Electricity | 5 | Active |
| US9359688B1 | Apparatuses and methods for controlling PH in electroplating baths | Chemistry; Metallurgy | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.