Electron microscopic inspection apparatus
US7091496B2 · kind B2 · utility
2Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2003 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Oct 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Both wafers on which copper wiring was performed and wafers on which non-copper wiring was performed can be inspected by a single unit of electron microscopic inspection apparatus with no possibilities of the wafers being contaminated with copper. All elements within the apparatus that come in contact with wafers, such as hands of a wafer transporter, are duplicated or more and one of the elements that contact wafers is used appropriately for the wafers under inspection which may be either the wafers on which copper wiring was performed or the wafers on which non-copper wiring was performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.