Patent · US Expired

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

US7091595B2 · kind B2 · utility

21Cited by

6References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Hermann Vilsmeier · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Nov 10, 2004
Grant date	Aug 15, 2006
Priority date	—
Expiry date	Nov 10, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.