Inventor · Regensburg, DE

Hermann Vilsmeier

12Patents
4h-index
20Co-inventors
49Inventor score

Filing activity: Feb 27, 2004 → Jan 25, 2008

Most-cited inventions

PatentTitleAreaCited byStatus
US7420262B2 Electronic component and semiconductor wafer, and method for producing the same Electricity 42 Expired
US7091595B2 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Electricity 21 Expired
US7009288B2 Semiconductor component with electromagnetic shielding device Electricity 13 Expired
US7944061B2 Semiconductor device having through contacts through a plastic housing composition and method for the production thereof Emerging Cross-Sectional Technologies 7 Active
US7883993B2 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same Electricity 3 Active
US8580070B2 Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer Electricity 1 Active
US7713791B2 Panel and semiconductor device having a composite plate with semiconductor chips Emerging Cross-Sectional Technologies 1 Active
US7663218B2 Integrated circuit component with a surface-mount housing Emerging Cross-Sectional Technologies 1 Active
US7327023B2 Semiconductor component with plastic housing, and process for producing the same Electricity 0 Expired
US7709379B2 Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof Emerging Cross-Sectional Technologies 0 Active
US7999362B2 Method and apparatus for making semiconductor devices including a foil Electricity 0 Active
US7772105B2 Semiconductor component with plastic housing, and process for producing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.