Crack resistant scribe line monitor structure and method for making the same
US7091621B1 · kind B1 · utility
5Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 2, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | Feb 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure prevents crack propagation to the active die circuitry of a main die area during sawing around the outer periphery of the main die area. Stress relief elements, such as dummy vias, are provided in the scribe line area between the saw lane and the main die area. The dummy vias prevent cracks induced by the sawing process from propagating to the main die area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.