Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates
US7094637B2 · kind B2 · utility
1Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | Oct 27, 2003 |
| Grant date | Aug 22, 2006 |
| Priority date | — |
| Expiry date | Jan 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
During a selective oxidation of gate structures that includes a polycrystalline silicon layer and a tungsten layer, which is known per se, a vapor deposition of tungsten oxide is prevented or at least greatly reduced by a special process. The gate structure is acted on by a hydrogen-containing, nonaqueous inert gas before and, if appropriate, after a treatment step with a hydrogen/water mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.