Environmental damage reduction
US7096752B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 2, 2004 |
| Grant date | Aug 29, 2006 |
| Priority date | — |
| Expiry date | Nov 2, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processor that processes and inspects a substrate. A substrate handler moves a substrate within the substrate processor. A processing chamber receives the substrate from the substrate handler, and processes the substrate using damaging material that is retained to some extent by the substrate. An inspection tool receives the substrate from the substrate handler after the substrate has been processed. A controlled environment surrounds at least a portion of the inspection tool and the substrate. A purge gas supply provides a purge gas at a flow rate. A moisture control unit adjusts the purge gas to a relative humidity, and gas inlets direct the purge gas into the controlled environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.