Ultra-thin wafer handling system
US7100954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2003 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Apr 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved Bernoulli end effector for holding, handling, and transporting ultra-thin substrates includes edge guides to aid in the positioning of the substrate and may include friction pads that impede motion of the substrate lifted by the end effector. The Bernoulli end effector may be incorporated into an apparatus and method for supinating a substrate so that both surfaces of the substrate can be processed. In addition, the Bernoulli end effector may be used to place ultra-thin substrates on and retrieve substrates from a substrate handling structure that includes weights that prevent the substrates from bowing or flexing during processing and includes guides that prevent the ultra-thin substrates from moving or translating on the surface of the substrate handling structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.