NEXX Systems, Inc.
🏢 View company profile →6Patents
4Active
6Granted
37Portfolio score
Filing activity: Jul 11, 2003 → May 28, 2010 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7100954B2 | Ultra-thin wafer handling system | Electricity | 30 | Expired |
| US7445697B2 | Method and apparatus for fluid processing a workpiece | Electricity | 29 | Expired |
| US7727366B2 | Balancing pressure to improve a fluid seal | Electricity | 10 | Active |
| US7722747B2 | Method and apparatus for fluid processing a workpiece | Electricity | 7 | Active |
| US8038856B2 | Method and apparatus for fluid processing a workpiece | Electricity | 5 | Active |
| US8168057B2 | Balancing pressure to improve a fluid seal | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.