Substrate polishing apparatus
US7101257B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 14, 2003 |
| Grant date | Sep 5, 2006 |
| Priority date | — |
| Expiry date | Jul 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.