Semiconductor manufacturing facility utilizing exhaust recirculation
US7105037B2 · kind B2 · utility
25Cited by
13References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Sep 26, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/909
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A semiconductor manufacturing process facility requiring use therein of air exhaust for its operation, such facility including clean room and gray room components, with the clean room having at least one semiconductor manufacturing tool therein, and wherein air exhaust is flowed through a region of the clean room. The facility includes an air exhaust treatment apparatus arranged to (i) receive air exhaust after flow thereof through said region of said clean room, (ii) produce a treated air exhaust, and (iii) recirculate the treated air exhaust to an ambient air environment in the facility, e.g., to the gray room of the facility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.