Power electronic system with passive cooling
US7106588B2 · kind B2 · utility
9Cited by
20References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2003 |
| Grant date | Sep 12, 2006 |
| Priority date | — |
| Expiry date | Jun 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.