Methods and apparatus having wafer level chip scale package for sensing elements
US7109055B2 · kind B2 · utility
51Cited by
8References
20Claims
0Family size
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Key dates
| Filing date | Jan 20, 2005 |
| Grant date | Sep 19, 2006 |
| Priority date | — |
| Expiry date | Jan 20, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Methods are provided for manufacturing a sensor. The method comprises depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material deposited at least partially onto the at least one sense element, forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material, and removing the sacrificial material. Apparatus for a sensor manufactured by the aforementioned method are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.