Absorber layer for DSA processing

US7109087B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Luc Van Autryve · Rixensart, BE
• Chris Bencher · San Jose, US
• Dean Jennings · San Ramon, US
• Haifan Liang · Fremont, US
• Abhilash J. Mayur · Salinas, US
• Mark Yam · Monte Sereno, US
• Wendy H. Yeh · Mountain View, US
• Richard Brough · Wingdale, US

Key dates

• Filing date: Oct 3, 2003
• Grant date: Sep 19, 2006
• Expiry date: Oct 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02274
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of processing a substrate comprising depositing a layer comprising amorphous carbon on the substrate and then laser annealing the substrate is provided. Optionally, the layer further comprises a dopant selected from the group consisting of nitrogen, boron, phosphorus, fluorine, and combinations thereof. In one aspect, the layer comprising amorphous carbon is an anti-reflective coating and an absorber layer that absorbs electromagnetic radiation emitted by the laser and anneals a top surface layer of the substrate.