Methods for forming an assembly for transfer of a useful layer
US7122095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2004 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Mar 21, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1994
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming an assembly for transfer of a useful layer are described. In an embodiment, the method includes forming a useful layer on a first support having an interface therebetween, and a residual material on a portion of the first support to form the assembly, and processing the assembly to attenuate any bond between the useful layer and the first support caused by the residual material. An implementation of the method includes processing the assembly to remove residual material. In another variation, processing of the assembly includes forming at least one cut or separating channel between a free surface of the useful layer and the interface to separate the useful layer from contact with the residual material. In yet another variation, processing of the assembly includes forming a peripheral recess so that the residual material does not contact the useful layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.