Olivier Rayssac
50Patents
10h-index
33Co-inventors
74Inventor score
Filing activity: Jul 14, 1999 → Nov 10, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6204079A | Selective transfer of elements from one support to another support | Electricity | 60 | Expired |
| US6756285B1 | Multilayer structure with controlled internal stresses and making same | Emerging Cross-Sectional Technologies | 43 | Expired |
| US7902038B2 | Detachable substrate with controlled mechanical strength and method of producing same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US7713369B2 | Detachable substrate or detachable structure and method for the production thereof | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6821376B1 | Method for separating two elements and a device therefor | Emerging Cross-Sectional Technologies | 26 | Expired |
| US6989314B2 | Semiconductor structure and method of making same | Electricity | 17 | Expired |
| US7498245B2 | Embrittled substrate and method for making same | Electricity | 15 | Expired |
| US7060590B2 | Layer transfer method | Electricity | 14 | Expired |
| US7182234B2 | Substrate cutting device and method | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7449394B2 | Atomic implantation and thermal treatment of a semiconductor layer | Electricity | 11 | Active |
| US7670929B2 | Method for direct bonding two semiconductor substrates | Electricity | 9 | Active |
| US7839001B2 | Methods for making substrates and substrates formed therefrom | Electricity | 9 | Active |
| US7122095B2 | Methods for forming an assembly for transfer of a useful layer | Emerging Cross-Sectional Technologies | 9 | Expired |
| US8083115B2 | Substrate cutting device and method | Emerging Cross-Sectional Technologies | 8 | Active |
| US7406994B2 | Substrate layer cutting device and method | Emerging Cross-Sectional Technologies | 8 | Active |
| US6913971B2 | Layer transfer methods | Electricity | 7 | Expired |
| US7256101B2 | Methods for preparing a semiconductor assembly | Electricity | 7 | Expired |
| US7615468B2 | Methods for making substrates and substrates formed therefrom | Electricity | 7 | Active |
| US7939428B2 | Methods for making substrates and substrates formed therefrom | Electricity | 6 | Active |
| US7575988B2 | Method of fabricating a hybrid substrate | Electricity | 5 | Active |
| US7888235B2 | Fabrication of substrates with a useful layer of monocrystalline semiconductor material | Emerging Cross-Sectional Technologies | 5 | Active |
| US7189304B2 | Substrate layer cutting device and method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7276428B2 | Methods for forming a semiconductor structure | Electricity | 4 | Expired |
| US7404870B2 | Methods for forming an assembly for transfer of a useful layer | Emerging Cross-Sectional Technologies | 3 | Active |
| US7041577B2 | Process for manufacturing a substrate and associated substrate | Emerging Cross-Sectional Technologies | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.