Methods for fabricating patterned features utilizing imprint lithography
US7122482B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 27, 2003 |
| Grant date | Oct 17, 2006 |
| Priority date | — |
| Expiry date | Nov 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
One embodiment of the present invention is a method for generating patterned features on a substrate that includes: (a) forming a first layer on at least a portion of a surface of the substrate, the first layer comprising at least one layer of a first material, which one layer abuts the surface of the substrate; (b) forming a second layer of a second material on at least a portion of the first layer, which second layer is imprinted with the patterned features; (c) removing at least portions of the second layer to extend the patterned features to the first layer; and (d) removing at least portions of the first layer to extend the patterned features to the substrate; wherein the first layer and the second layer may be exposed to an etching process that undercuts the patterned features, and the first material may be lifted-off.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.