Patent · US Expired

Method and apparatus for imager die package quality testing

US7122819B2 · kind B2 · utility

0Cited by
12References
50Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMay 6, 2004
Grant dateOct 17, 2006
Priority date—
Expiry dateDec 21, 2024

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N21/8806
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

An apparatus and method of detecting a defect in an imager die package. The method comprises the steps of exposing the imager die package to light at a first angle, exposing the imager die package to light at a second angle, outputting electrical signals based on the exposures; and determining the level at which a defect is present based on the output electrical signals. An exemplary embodiment of the apparatus comprises a first light source positioned over an imager die package at a first angle, a second light source over the imager die package at a second angle, said first and second angles being different from each other; and a processor for determining a level of defection in the die package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.