Polymers, resist compositions and patterning process
US7125643B2 · kind B2 · utility
7Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | Oct 21, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Nov 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A polymer comprising recurring units of formula (1) and recurring units of formulae (2a) to (2d) wherein R1 is F or fluoroalkyl, R2 is a single bond or an alkylene or fluoroalkylene, R3 and R4 are H, F, alkyl or fluoroalkyl, at least one of R3 and R4 contains F, R5 is H or an acid labile group, R6 is an acid labile group, adhesive group, alkyl or fluoroalkyl, and “a” is 1 or 2 is used as a base resin to formulate a resist composition which has advantages including high transparency to radiation having a wavelength of up to 200 nm, substrate adhesion, developer affinity and dry etching resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.